Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2007-07-03
2010-10-19
Fourson, George (Department: 2823)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C438S636000, C438S688000, C257SE21627
Reexamination Certificate
active
07816260
ABSTRACT:
A method for fabricating a semiconductor device according to the present invention includes: a step for forming a wiring layer on a semiconductor substrate; a step for patterning the wiring layer; and a step for covering the wiring layer with a protective insulating film. Moreover, after the step for forming the wiring layer, all required heat treatment steps to be performed prior to the step for covering the wiring layer with the protective insulating film are performed at a temperature lower than a temperature for plastic deformation of the wiring layer.
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Fourson George
Oki Semiconductor Co., Ltd.
Parker John M
Rabin & Berdo PC
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