Method for fabricating semiconductor device

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – Insulated gate formation

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

438660, H01L 213205

Patent

active

061036099

ABSTRACT:
Method for fabricating a semiconductor device, is disclosed, in which a grain size is made coarse for forming a thin film with a low resistance, including the steps of (1) depositing an insulating film on a substrate, (2) depositing a silicon layer on the insulating film, (3) depositing an amorphous metal nitride film on the silicon layer, and (4) heat treating the amorphous metal nitride film to alter into a crystalline pure metal film.

REFERENCES:
patent: 5416045 (1995-05-01), Kauffman et al.
patent: 5604140 (1997-02-01), Byun
patent: 5733816 (1998-03-01), Iyer et al.
patent: 5874353 (1999-02-01), Lin et al.
patent: 5888588 (1999-03-01), Nagabushnam et al.
patent: 5902129 (1999-05-01), Yoshikawa et al.
patent: 5923999 (1999-07-01), Balsubramanyam et al.
patent: 5958508 (1999-09-01), Adetutu et al.
patent: 5976962 (1999-11-01), Oda
patent: 6022795 (2000-02-01), Chen et al.
patent: 6027961 (2000-02-01), Maiti et al.
patent: 6043148 (2000-03-01), Peng et al.
M.T. Takagi et al., ULSI Device Engineering Lab, IEDM 96 pp. 455-458.
Y. Akasaka et al., ULSI research Labs, 1995 ISMIC 104/95/0168, pp. 168-174.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method for fabricating semiconductor device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for fabricating semiconductor device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for fabricating semiconductor device will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2006293

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.