Method for fabricating semiconductor device

Semiconductor device manufacturing: process – Introduction of conductivity modifying dopant into... – Ion implantation of dopant into semiconductor region

Reexamination Certificate

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C438S532000, C438S533000

Reexamination Certificate

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06927152

ABSTRACT:
The present invention relates to a method for fabricating a semiconductor device. The method comprises the steps of: 1. A method for fabricating a semiconductor device, which comprises the steps of: forming a gate line on a semiconductor substrate; forming junction regions in the semiconductor substrate at both sides of the gate line; forming and selectively removing an interlayer insulating film on the substrate to form contact holes exposing the junction regions; forming plugs in the contact holes; and implanting impurity ions into the plugs; and annealing the junction regions.

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patent: 5599736 (1997-02-01), Tseng
patent: 5970331 (1999-10-01), Gardner et al.
patent: 6051487 (2000-04-01), Gardner et al.
patent: 6214682 (2001-04-01), Wang
patent: 6277739 (2001-08-01), Tseng
patent: 6284581 (2001-09-01), Pan et al.
patent: 6312981 (2001-11-01), Akamatsu et al.
patent: 6596632 (2003-07-01), Roberts et al.

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