Method for fabricating polysilicon film

Semiconductor device manufacturing: process – Formation of semiconductive active region on any substrate – Amorphous semiconductor

Reexamination Certificate

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Details

C438S647000, C438S680000, C257S382000, C257S412000

Reexamination Certificate

active

07939434

ABSTRACT:
A method of directly depositing a polysilicon film at a low temperature is disclosed. The method comprises providing a substrate and performing a sequential deposition process. The sequential deposition process comprises first and second deposition steps. In the first deposition step, a first bias voltage is applied to the substrate, and plasma chemical vapor deposition is utilized to form a first polysilicon sub-layer on the substrate. In the second deposition step, a second bias voltage is applied to the substrate, and plasma chemical vapor deposition is utilized to form a second polysilicon sub-layer on the first sub-layer. The first and second sub-layers constitute the polysilicon film, and the first bias voltage differs from the second bias voltage.

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H. Pierson “Handbook of Chemical Vapor Deposition (CVD). Principles, Technology and Application. 2nd Edition”, (C) 1999, Noyes Publications.

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