Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1989-10-27
1990-08-07
Rowell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156646, 156655, 1566591, 156668, 156345, 20419236, 252 791, B44C 122, C03C 1500, C03C 2506, B29C 3700
Patent
active
049465490
ABSTRACT:
Disclosed is a method for removing poly-para-xylylene, its derivatives, and copolymers (collectively called "parylene") from bodies, including relatively large bodies such as printed circuit (PC) boards, that is capable of yielding relatively high removal rates. A body such as a PC board coated with parylene is placed into a reaction chamber downstream from a microwave plasma such that plasma discharge products generated by the microwave plasma react with the parylene, etching the parylene without exposing the body to bombardment by energetic ions and/or electrons. The plasma is generated from a gas mixture containing oxygen, a second gas, and optional additives such as N.sub.2 O, He,or Ar. The second gas is selected from the group consisting of fluorocarbons, fluorosulfides, and chlorofluorocarbons. A currently preferred second gas is CFR.sub.4. The inventive method is also applicable for fabricating articles such as integrated circuits and semiconductor devices that comprise a parylene layer.
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Bachman Bonnie J.
Hofstatter Elizabeth A.
Ritter Joan M.
Rubin Jerry J.
AT&T Bell Laboratories
Cochran David R.
Pacher Eugen E.
Rowell William A.
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