Method for fabricating nitride-based compound semiconductor...

Semiconductor device manufacturing: process – Chemical etching – Having liquid and vapor etching steps

Reexamination Certificate

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C438S706000, C438S718000, C438S745000

Reexamination Certificate

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07148149

ABSTRACT:
A method for fabricating a nitride semiconductor element according to the present invention comprises the steps of: forming a nitride semiconductor layer13on a base substrate11; forming, on part of the upper surface of the nitride semiconductor layer13, a conductive film14made of an electron emitting layer14band a dry etching mask layer14afrom bottom to top; performing dry etching on the nitride semiconductor layer13; and performing wet etching on the nitride semiconductor layer13by emitting electrons from the nitride semiconductor layer13through the conductive film14to the outside.

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Adesida, I. et al., “Dry and Wet Etching for Group III—Nitrides”, MRS Internet. J. Nitride Semiconoductor Res. 4S1, GI.4 (1999).

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