Method for fabricating MOS transistor utilizing doped disposable

Fishing – trapping – and vermin destroying

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437240, 148DIG144, H01L 21225

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active

055997341

ABSTRACT:
A method for fabricating an MOS transistor includes the steps of forming a gate insulating layer on a substrate of a first conductivity-type, forming a gate on the gate insulating layer, forming a disposable layer over an entire surface of the substrate and the gate, the disposable layer having a first conductivity-type impurity and a second conductivity-type impurity of a higher concentration than that of the first conductivity-type impurity, and forming a source and drain area of the second conductivity-type impurity on the substrate by diffusing the second conductivity-type impurity of the disposable layer into the substrate by means of an annealing process, wherein the disposable layer includes a BPSG layer, wherein the BPSG layer is a B+PSG layer which is doped with a higher dopant concentration of boron than that of phosphorus to make a p-type MOS transistor.

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"An SPDD P-MOSFET Structure Suitable for 0.1 and Sub 0.1 Micron Channel Length and its Electrical Characteristics"; M. Saito, T. Yoshitomi, M. Ono, Y. Akasaka, H. Nii, S. Matsuda, H. S. Momose, Y. Katsumata, Y. Ushiku and H. Iwai; IEEE Meeting Dec. 13-16, 1992.

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