Method for fabricating microstructures using temporary bridges

Details Method for fabricating microstructures using temporary bridges Method for fabricating microstructures using temporary bridges

1993-08-04

1994-11-15

Powell, William

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156643, 156657, 437921, B44C 122, H01L 21306

Patent

active

053644972

ABSTRACT:
A method and apparatus for forming bridges between surfaces of a suspended microstructure and other surfaces of the suspended microstructure or particularly placed anchors on the die in order to increase the stiffness and lateral strength of the microstructure during fabrication. Once fabrication is completed, the bridges are cut by a laser thus fully releasing the microstructure into its final suspended and resilient condition.

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patent: 4893509 (1990-01-01), MacIver et al.
patent: 5130276 (1992-07-01), Adams et al.
Thermal Assembly of Polysilicon Microactuators With Narrow-Gap Elecrostatic Comb Drive, G. K. Fedder, J. C. Chang and K. T. Howe, IEEE, 1992 pp. 63-68.
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Chemical Surface Modification of Porous Silicon, R. C. Anderson, R. S. Muller and C. W. Tobias, J. Electrochem. Soc., vol. 140, No. 5 May 1993, The Electrochemical Society, Inc.
Polysilicon Resistor Trimming by Laser Link Making, D. L. Parker and W. Huang, IEEE Transactions on Semiconductor Mfg. vol. 3 No. 2 May 1990, pp. 80-83.
Micromachining for Packaged Sensors, M. Esashi, 7th Inter. Conf. on Solid-State Sensors and Actuators.

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