Method for fabricating metal silicide

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material

Reexamination Certificate

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C257SE21211

Reexamination Certificate

active

07943512

ABSTRACT:
A method for fabricating a metal silicide film is described. After providing a silicon material layer, a metal alloy layer is formed to cover the silicon material layer. A thermal process is performed to form a metal alloy silicide layer in a self-aligned way. A wet etching process is performed by using a cleaning solution including sulfuric acid and hydrogen peroxide to remove the residual metals and unreacted metal alloy.

REFERENCES:
patent: 6426291 (2002-07-01), Hu et al.
patent: 6797614 (2004-09-01), Paton et al.
patent: 2002/0146904 (2002-10-01), Buynoski et al.
patent: 2003/0082880 (2003-05-01), Yu et al.
patent: 2003/0186022 (2003-10-01), Homma
patent: 2005/0158996 (2005-07-01), Kim et al.
patent: 2005/0176205 (2005-08-01), Chien et al.
patent: 2006/0042651 (2006-03-01), Verhaverbeke et al.
patent: 2006/0266737 (2006-11-01), Hanestad et al.
patent: 2008/0106942 (2008-05-01), Kim et al.
patent: 2009/0152600 (2009-06-01), Raghavan et al.

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