Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2011-05-17
2011-05-17
Pert, Evan (Department: 2893)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C257SE21211
Reexamination Certificate
active
07943512
ABSTRACT:
A method for fabricating a metal silicide film is described. After providing a silicon material layer, a metal alloy layer is formed to cover the silicon material layer. A thermal process is performed to form a metal alloy silicide layer in a self-aligned way. A wet etching process is performed by using a cleaning solution including sulfuric acid and hydrogen peroxide to remove the residual metals and unreacted metal alloy.
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Chen Yi-Wei
Ho Nien-Ting
Lai Kuo-Chih
King Justin
Kolahdouzan Hajar
Pert Evan
United Microelectronics Corp.
WPAT, PC
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