Method for fabricating MEMS device package that includes...

Details Method for fabricating MEMS device package that includes... Method for fabricating MEMS device package that includes...

2007-06-13

2009-11-10

Smoot, Stephen W (Department: 2813)

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Physical stress responsive

C438S458000, C438S459000, C257SE21505

Reexamination Certificate

active

07615394

ABSTRACT:
A package of a micro-electro-mechanical systems (MEMS) device includes a cap wafer, a plurality of bonding bumps formed over the cap wafer, a plurality of array pads arrayed on an outer side of the bonding bumps, and an MEMS device wafer bonded to an upper portion of the cap wafer in a manner to expose the array pads.

REFERENCES:
patent: 2003/0087469 (2003-05-01), Ma
patent: 2005/0062120 (2005-03-01), Ma et al.
patent: 2006/0208326 (2006-09-01), Nasiri et al.
patent: 2007/0128828 (2007-06-01), Chen et al.
patent: 2007/0269934 (2007-11-01), Thompson et al.
patent: 2008/0169521 (2008-07-01), Foster et al.
patent: 2008/0272446 (2008-11-01), Haluzak et al.
patent: 2005-66727 (2005-03-01), None

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