Method for fabricating IC board without ring structure

Details Method for fabricating IC board without ring structure Method for fabricating IC board without ring structure

2007-03-09

2009-02-10

Toledo, Fernando L (Department: 2895)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S667000, C029S852000, C029S025010

Reexamination Certificate

active

07488675

ABSTRACT:
A method for fabricating an IC board without a ring structure is provided. In the method, after the completion of the core board (including the core through hole), the second pattern photoresist layer is used to mask over the first deposited metal layer, and a portion of the second deposited metal layer (this portion of the second deposited metal layer is to electrically couple to the conductive circuit of the core through hole). Later, the second deposited metal layer, the first deposited metal layer, the metal layer, and the substrate at the innermost layer which are not masked by the second pattern photoresist layer are removed. As a result, the substrate is exposed to form the ringless structure, and to couple a conductive line to the core board through hole.

REFERENCES:
patent: 5882957 (1999-03-01), Lin
patent: 5884396 (1999-03-01), Lin
patent: 2003/0056366 (2003-03-01), Peng
patent: 2006/0255009 (2006-11-01), Card et al.
S. Wolf and R.N. Tauber(Silicon Processing for the VLSI Era, Vol. 1: Process Technology, 1986).

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