Method for fabricating hybrid integrated circuit

Details Method for fabricating hybrid integrated circuit Method for fabricating hybrid integrated circuit

1988-07-25

1990-02-06

Dees, Jose G.

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Making electrical device

430311, 430313, 430318, 427 98, G03C 500

Patent

active

048988057

ABSTRACT:
A method for fabricating a hybrid IC substrate comprises the steps of baking a conductor of a first group on an insulating ceramic substrate, forming an insulating porous active layer including a glass component and a small amount of a metal component having a catalytic action for electroless plating, forming a resist pattern on the active layer by using a photomask, and forming a conductor of a second group by electroless plating on a portion of the active layer not covered with the resist, whereby a portion of the active layer sandwiched between the conductors of the first and second groups is rendered conductive and a portion of the active layer in direct contact with the insulating substrate is maintained as an insulator.

REFERENCES:
patent: 4150995 (1979-04-01), Moritsu et al.
patent: 4487811 (1984-12-01), Eichelberger et al.
patent: 4629681 (1986-12-01), Takada et al.
patent: 4685203 (1987-08-01), Takada et al.
patent: 4752555 (1988-06-01), Takada et al.

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