Method for fabricating heat dissipating package structure

Details Method for fabricating heat dissipating package structure Method for fabricating heat dissipating package structure

2007-12-12

2011-11-22

Landau, Matthew (Department: 2813)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C438S106000, C438S108000, C438S112000, C438S118000, C438S123000, C438S458000, C257S675000, C257S706000, C257S707000, C257S720000, C257S796000, C257SE23051, C257SE23101

Reexamination Certificate

active

08062933

ABSTRACT:
A heat dissipating package structure includes a chip carrier; a semiconductor chip mounted and electrically connected to the chip carrier; an encapsulant formed on the chip carrier and for encapsulating the chip, with a non-active surface of the chip being exposed from the encapsulant; and a heat spreader having a hollow portion and attached to the encapsulant, wherein the chip is received in the hollow portion and the non-active surface of the chip is completely exposed to the hollow portion, such that heat generated by the chip can be directly dissipated out of the package structure. The present invention also provides a method for fabricating the heat dissipating package structure.

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