Method for fabricating electrical connections of circuit board

Details Method for fabricating electrical connections of circuit board Method for fabricating electrical connections of circuit board

2007-05-15

2007-05-15

Vo, Peter (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S846000, C029S847000, C029S850000, C029S852000, C029S874000, C228S180220

Reexamination Certificate

active

11023363

ABSTRACT:
A method for fabricating electrical connections of a circuit board is provided. The circuit board has a plurality of electrical connection pads thereon. A protective layer is applied on the circuit board and has a plurality of openings for exposing the electrical connection pads. A conductive layer is formed on the protective layer and the electrical connection pads. A resist layer is applied on the conductive layer and has a set of openings for exposing a portion of the conductive layer covering some of the electrical connection pads. A first metal layer is electroplated in the openings of the resist layer. Another set of openings are formed through the resist layer corresponding to the rest of the electrical connection pads. A second metal layer is electroplated on the first metal layer and above the rest of the electrical connection pads to form different electrical connections on the circuit board.

REFERENCES:
patent: 6576541 (2003-06-01), Hu
patent: 7081402 (2006-07-01), Hsu et al.
patent: 2001/0040290 (2001-11-01), Sakurai et al.
patent: 2006/0090335 (2006-05-01), Hsu et al.

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