Method for fabricating electrical connection structure of...

Metal working – Method of mechanical manufacture – Electrical device making

Reexamination Certificate

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Details

C029S830000, C029S842000, C029S846000, C029S853000, C156S182000, C156S230000, C228S180220, C257SE23172, C257SE23173, C257SE23177

Reexamination Certificate

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07340829

ABSTRACT:
A method for fabricating an electrical connection structure of a circuit board is proposed. The circuit board is provided with a plurality of pads on a surface thereof and with a plurality of conductive structures therein for electrically connecting the pad. A plurality of openings is formed penetrating through an insulating layer provided on the circuit board to expose the pad. Subsequently, a conductive base is attached to one surface of the circuit board for electrically connecting the pad. By such arrangement, a conductive material can be formed on the pad located on the other surface of the circuit board by an electroplating process via the conductive base, the pad on the surface, and the conductive structure within the circuit board.

REFERENCES:
patent: 5209817 (1993-05-01), Ahmad et al.
patent: 5426849 (1995-06-01), Kimbara et al.
patent: 508987 (2003-01-01), None

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