Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2006-12-19
2006-12-19
Hoang, Quoc (Department: 2818)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C438S612000, C438S508000, C438S613000, C438S508000, C257S772000, C257SE23002, C257SE23021, C257SE23069
Reexamination Certificate
active
07151050
ABSTRACT:
A method for fabricating an electrical connection structure of a circuit board is proposed. A patterned resist layer is formed on the circuit board having a plurality of conductive pads, and a plurality of openings is formed in the resist layer to expose the conductive pads. A first conductive material and a second conductive material are successively deposited in the openings of the resist layer and on each of the conductive pads. Then, the resist layer is removed. Subsequently, a protective layer is applied on the circuit board and covers the first and second conductive materials formed on each of the conductive pads. Finally, the protective layer is thinned to expose the second conductive material corresponding in position to each of the conductive pads. Thus, the circuit board can be electrically connected to an external device via the second conductive material.
REFERENCES:
patent: 4087314 (1978-05-01), George et al.
patent: 6566239 (2003-05-01), Makino et al.
Hsu Shih-Ping
Hu Wen-Hung
Shih Chao-Wen
Tang Sao-Hsia
Wang Ying-Tung
Fischer Morland C.
Hoang Quoc
Phoenix Precision Technology Corporation
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