Method for fabricating dual damascene structures using...

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Making named article

Reexamination Certificate

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C430S323000

Reexamination Certificate

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07862989

ABSTRACT:
The process of producing a dual damascene structure used for the interconnect architecture of semiconductor chips. More specifically the use of imprint lithography to fabricate dual damascene structures in a dielectric and the fabrication of dual damascene structured molds.

REFERENCES:
patent: 6350360 (2002-02-01), Bonivert et al.
patent: 2003/0162406 (2003-08-01), Gehoski et al.
patent: 2004/0224261 (2004-11-01), Resnick et al.
patent: 2005/0184376 (2005-08-01), Salmon

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