Method for fabricating dual damascene structures

Details Method for fabricating dual damascene structures Method for fabricating dual damascene structures

2008-05-15

2010-06-01

Duda, Kathleen (Department: 1795)

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Making electrical device

C430S313000, C430S394000

Reexamination Certificate

active

07727708

ABSTRACT:
A method for fabricating a dual damascene structure includes providing a multi-layer photoresist stack comprising a first photoresist layer and a second photoresist layer, wherein each photoresist layer has a distinct dose-to-clear value, exposing said photoresist stack to one or more predetermined patterns of light, and developing said photo-resist layers to form a multi-tiered structure in the photo-resist layers.

REFERENCES:
patent: 5288660 (1994-02-01), Hua et al.
patent: 5370973 (1994-12-01), Nishii

Affiliated with

Also associated with

Rating

Method for fabricating dual damascene structures does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for fabricating dual damascene structures, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for fabricating dual damascene structures will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4240684