Method for fabricating connection terminal of circuit board

Details Method for fabricating connection terminal of circuit board Method for fabricating connection terminal of circuit board

2007-02-13

2007-02-13

Arbes, Carl J. (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S846000, C029S847000, C029S852000

Reexamination Certificate

active

11060497

ABSTRACT:
A method for fabricating connection terminals of a circuit board is proposed. The method involves providing a circuit board with connection pads thereon, forming an insulating layer with first openings over the circuit board to expose the connection pads, forming a conductive layer over the insulating layer, forming a first resist layer with second openings over the conductive layer to partially expose the conductive layer, electroplating a first metal connection layer on the exposed conductive layer, followed by forming a second resist layer with third openings over the first conductive layer to partially expose the first metal connection layer, and electroplating a second metal connection layer on the exposed first connection layer, and removing portions of the first and second resist layers and conductive layer covered by the first and second resist layers to form metal connection material of different heights and sizes on the connection pads.

REFERENCES:
patent: 6678952 (2004-01-01), Jamil
patent: 6841849 (2005-01-01), Miyazawa
patent: 2001/0040290 (2001-11-01), Sakurai et al.
patent: 2002/0078561 (2002-06-01), Jamil

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