Method for fabricating conductive bumps with non-conductive...

Details Method for fabricating conductive bumps with non-conductive... Method for fabricating conductive bumps with non-conductive...

2008-03-25

2008-03-25

Rose, Kiesha L. (Department: 2822)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C257S737000

Reexamination Certificate

active

11644184

ABSTRACT:
A microelectronic structure having a substrate of multiple conductive bumps for contact with bond pads on an electronic substrate in the fabrication of a flip chip electronic assembly. Each of the conductive bumps includes a conductive layer which is absent from at least one sidewall of the bump to prevent the inadvertent formation of a short-circuiting electrical path between adjacent conductive bumps in the electronic assembly.

REFERENCES:
patent: 6333555 (2001-12-01), Farnworth et al.
patent: 6767818 (2004-07-01), Chang et al.
patent: 2003/0183933 (2003-10-01), Kobayashi
patent: 2004/0219715 (2004-11-01), Kwon et al.

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