Method for fabricating circuitry component

Details Method for fabricating circuitry component Method for fabricating circuitry component

2007-11-20

2007-11-20

Chambliss, Alonzo (Department: 2814)

Semiconductor device manufacturing: process

Bonding of plural semiconductor substrates

Thinning of semiconductor substrate

C438S613000, C438S622000, C029S729000, C029S738000

Reexamination Certificate

active

10794472

ABSTRACT:
An integrated chip package structure and method of manufacturing the same is by adhering dies on an organic substrate and forming a thin-film circuit layer on top of the dies and the organic substrate. Wherein the thin-film circuit layer has an external circuitry, which is electrically connected to the metal pads of the dies, that extends to a region outside the active surface of the dies for fanning out the metal pads of the dies. Furthermore, a plurality of active devices and an internal circuitry is located on the active surface of the dies. Signal for the active devices are transmitted through the internal circuitry to the external circuitry and from the external circuitry through the internal circuitry back to other active devices. Moreover, the chip package structure allows multiple dies with different functions to be packaged into an integrated package and electrically connecting the dies by the external circuitry.

REFERENCES:
patent: 5250843 (1993-10-01), Eichelberger
patent: 5324687 (1994-06-01), Wojnarowski
patent: 5353498 (1994-10-01), Fillion et al.
patent: 5565706 (1996-10-01), Miura et al.
patent: 5841193 (1998-11-01), Eichelberger
patent: 5874770 (1999-02-01), Saia et al.
patent: 6110806 (2000-08-01), Pogge
patent: 6121688 (2000-09-01), Akagawa
patent: 6271469 (2001-08-01), Ma et al.
patent: 6396148 (2002-05-01), Eichelberger et al.
patent: 6555908 (2003-04-01), Eichelberger et al.
patent: 6673698 (2004-01-01), Lin et al.
patent: 6746898 (2004-06-01), Lin et al.
patent: 6800941 (2004-10-01), Lee et al.
patent: 2001/0021541 (2001-09-01), Akram et al.
patent: 2002/0070443 (2002-06-01), Mu et al.
patent: 2002/0074641 (2002-06-01), Towle et al.
patent: 2002/0137263 (2002-09-01), Towle et al.
patent: 2002/0158334 (2002-10-01), Vu et al.
patent: 1094511 (2001-04-01), None

Affiliated with

Also associated with

Rating

Method for fabricating circuitry component does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for fabricating circuitry component, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for fabricating circuitry component will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3881449