Metal working – Method of mechanical manufacture – Electrical device making
Patent
1996-08-06
1999-03-23
Johnson, Linda
Metal working
Method of mechanical manufacture
Electrical device making
29852, H05K 334
Patent
active
058843973
ABSTRACT:
A method for fabricating a chip carrier and attaching the chip carrier to a printed circuit board is disclosed. A plated through hole (PTH) is formed through a chip carrier substrate. The PTH has surface lands on opposite surfaces of the substrate. Next, at least one of the surfaces of the substrate is covered with a dielectric material. The dielectric material at least partially fills the PTH. A solder ball is attached to the surface land on the opposite side as the dielectric material. Then, a printed circuit board is positioned relative to the chip carrier such that the solder ball contacts a surface land of the printed circuit board. Then, the solder is reflowed. Because the solder is reflowed while the dielectric material at least partially fills the PTH, the dielectric material within the PTH prevents the solder from flowing entirely through the PTH. This prevents contamination of the opposite surface of the chip carrier.
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Armezzani Gregg Joseph
Desai Kishor Vithaldas
Perkins Jeffrey Scott
Pessarchick John James
International Business Machines - Corporation
Johnson Linda
Samodovitz Arthur J.
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