Etching a substrate: processes – Forming or treating electrical conductor article – Forming or treating of groove or through hole
Patent
1997-05-19
2000-07-18
Gulakowski, Randy
Etching a substrate: processes
Forming or treating electrical conductor article
Forming or treating of groove or through hole
216 18, 216 39, 216 56, 216 99, 438613, 438616, H01L 21302
Patent
active
060903015
ABSTRACT:
A method for fabricating a bump forming plate member by which bumps can be formed on an electronic component. A mask is formed on a surface of a crystalline plate, and the crystalline plate is subjected to anisotropic etching to form a plurality of grooves. The crystalline plate is also subjected to isotropic etching to deepen the grooves. The method can further includes additional anisotropic and isotropic etchings. Also, a method for fabricating a metallic bump forming plate member is disclosed. This method uses the above described crystalline plate having the grooves, and includes fabrication of a replica using the crystalline plate as an original, and fabrication of a metallic bump forming plate member using the replica as an original.
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Kasai Junichi
Mizukoshi Masataka
Otake Koki
Yamaguchi Ichiro
Yoshikawa Masahiro
Alanko Anita
Fujitsu Limited
Gulakowski Randy
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