Method for fabricating an exposure mask including a step for adh

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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Details

156656, 156657, 156662, H01L 21306, B44C 122, C23F 100

Patent

active

051850540

ABSTRACT:
A method for fabricating an exposure mask includes steps of: forming a layered body comprising a substrate, a membrane transparent to an X-ray and provided on the upper major surface of the substrate, and an X-ray absorbing film provided on the membrane; adhering a support ring on a lower major surface of the substrate; carrying out etching on an area on the lower major surface of the substrate until a lower major surface of the membrane is exposed, the area corresponding to an inside of the support ring block; and patterning the X-ray absorbing film into a desired semiconductor pattern. The step of adhering the substrate to the support ring includes steps of placing an adhesive layer between a lower major surface of the layered body and the upper major surface of the support ring; and adhering the layered body to the support ring by applying a gas pressure on an upper major surface of the layered body so that the layered body is pressed via the adhesive layer against the support ring and adhered thereto by the adhesive layer.

REFERENCES:
patent: 4170512 (1979-10-01), Flanders et al.

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