Method for fabricating an electronic device having solder joints

Details Method for fabricating an electronic device having solder joints Method for fabricating an electronic device having solder joints

1995-06-02

1997-06-24

Ramsey, Kenneth J.

Metal fusion bonding

Process

Plural joints

H01L 21283

Patent

active

056411138

ABSTRACT:
Solder joints are formed on external electrodes of a semiconductor device, such as a ball grid array package or flip chip or the like, and higher solder joints are formed on the external electrodes. Each solder joint consists of a plurality of solder bumps, such as a first solder bump and a second solder bump. The process includes the steps of forming a first solder bump on an electrode, the electrode being electrically connected with a terminal of an electronic circuit, applying a first non-conductive material onto the first solder bump so as to encompass with the first non-conductive material the exposed area of the first solder bump except for a top portion of the first solder bump, and forming a second solder bump on the top portion of the first solder bump. A semiconductor device having solder joints higher than the single greatest possible solder ball for a given pitch and pad area is fabricated.

REFERENCES:
patent: 4376505 (1983-03-01), Wojcik
patent: 5001829 (1991-03-01), Schelhorn
patent: 5251806 (1993-10-01), Agarwala et al.

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