4. Metal fusion bonding
  5. Process
  6. Plural joints

OKI Electronic Industry Co., Ltd.

Corporate Assignee

Rate now
  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

Corporate Assignee

active

No affiliations

Method for fabricating an electronic device having solder joints

Metal fusion bonding – Process – Plural joints
Patent

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Process for manufacturing semiconductor device

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

OKI Electronic Industry Co., Ltd. does not yet have a rating. At this time, there are no reviews or comments for this inventor.

If you have personal experience with OKI Electronic Industry Co., Ltd., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and OKI Electronic Industry Co., Ltd. will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-P-286550

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.

Canada

 Charities
 Companies
 MP Candidates
 Patents
 Employee Salary Disclosure

World

 Places of the World
 Scientific Papers

United States

 Banks
 Companies
 Counties
 Patents
 Employee Salary Disclosure