Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2007-09-11
2007-09-11
Tugbang, A. Dexter (Department: 3729)
Metal working
Method of mechanical manufacture
Electrical device making
C029S825000, C029S829000, C029S831000, C029S849000, C174S255000, C174S536000, C257S691000, C257S701000, C257S735000, C257S773000
Reexamination Certificate
active
11043496
ABSTRACT:
A and method for fabricating a warpage-preventive circuit board is provided, wherein a plurality of conductive traces are formed on a surface of an electrically-insulative core layer, and a plurality of discontinuous dummy circuit regions are disposed on the surface of the electrically-insulative core layer at area free of the conductive traces, with adjacent dummy circuit regions being spaced apart by at least a chink. During a high-temperature fabrication process, the dummy circuit regions help reduce thermal stress and the chinks absorb thermal expansion of the dummy circuit regions, to thereby prevent warpage of the circuit board and cracks of a chip mounted on the circuit board, such that yield and reliability of fabricated semiconductor devices can be improved.
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Chang Chin-Huang
Chiu Chin-Tien
Liu Chung-Lun
Corless Peter F.
Jensen Steven M.
Phan Tim
Siliconware Precision Industries Co. Ltd.
Tugbang A. Dexter
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