Semiconductor device manufacturing: process – Formation of electrically isolated lateral semiconductive... – Recessed oxide by localized oxidation
Reexamination Certificate
2008-07-01
2008-07-01
Smith, Zandra (Department: 2822)
Semiconductor device manufacturing: process
Formation of electrically isolated lateral semiconductive...
Recessed oxide by localized oxidation
C438S424000, C438S440000, C438S435000, C257SE21002
Reexamination Certificate
active
07393756
ABSTRACT:
A method for fabricating a trench isolation structure wherein a trench is formed in a silicon body and an oxide layer is formed in the trench. The silicon body is exposed at the bottom of the trench by means of an etching step, and silicon oxide is selectively grown on the silicon exposed at the bottom of the trench, the silicon oxide being grown from the bottom of the trench toward an upper edge of the trench.
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Infineon - Technologies AG
Novacek Christy L
Slater & Matsil L.L.P.
Smith Zandra
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