Metal working – Piezoelectric device making
Reexamination Certificate
2005-01-11
2005-01-11
Tugbang, A. Dexter (Department: 3729)
Metal working
Piezoelectric device making
C029S594000, C029S846000, C029S847000, C029S852000, C310S321000
Reexamination Certificate
active
06839946
ABSTRACT:
A method for fabricating a Thin Film Bulk Acoustic Wave Resonator (FBAR). The method comprises the steps of: (A) forming a sacrificial layer comprising one of a metal and a polymer over a selected portion of a substrate; (B) forming a protective layer on the sacrificial layer and on selected portions of the substrate; (C) forming a bottom electrode layer on a selected portion of the protective layer; (D) forming a piezoelectric layer on a selected portion of the bottom electrode layer and on a selected portion of the protective layer; (E) forming a top electrode on a selected portion of the piezoelectric layer; and (F) removing the sacrificial layer to form an air gap. The use of a metal or a polymer material to form sacrificial layers has several advantages over the use of zinc-oxide (ZnO) to form such layers. In accordance with a further aspect of the invention, an FBAR is provided which includes a glass substrate. The use of glass to form substrates offers several advantages over the use of other materials to form substrates. By example, most types of glass are less expensive than semiconductor materials, and exhibit low permittivity characteristics, and low parasitic capacitances. In addition, most glass materials are substantially loss free when being used in microwave frequency applications.
REFERENCES:
patent: 3173100 (1965-03-01), White
patent: 3293557 (1966-12-01), Dentor
patent: 3486046 (1969-12-01), Zalar
patent: 3568108 (1971-03-01), Poirier et al.
patent: 3686579 (1972-08-01), Everett
patent: 3696312 (1972-10-01), Kuhn et al.
patent: 3760471 (1973-09-01), Borner
patent: 3764928 (1973-10-01), Gires et al.
patent: 3916490 (1975-11-01), Sheahan et al.
patent: 3924312 (1975-12-01), Coussot et al.
patent: 4019181 (1977-04-01), Olsson et al.
patent: 4166967 (1979-09-01), Benes et al.
patent: 4320365 (1982-03-01), Black et al.
patent: 4365216 (1982-12-01), Minagawa et al.
patent: 4418299 (1983-11-01), Momosaki
patent: 4456850 (1984-06-01), Inoue et al.
patent: 4502932 (1985-03-01), Kline et al.
patent: 4556812 (1985-12-01), Kline et al.
patent: 4562370 (1985-12-01), Von Dach
patent: 4642508 (1987-02-01), Suzuki et al.
patent: 4897618 (1990-01-01), Svetanoff
patent: 5153476 (1992-10-01), Kosinski
patent: 5162691 (1992-11-01), Mariani et al.
patent: 5166646 (1992-11-01), Avanic et al.
patent: 5185589 (1993-02-01), Krishnaswamy et al.
patent: 5233259 (1993-08-01), Krishnaswamy et al.
patent: 5332943 (1994-07-01), Bhardwaj
patent: 5373268 (1994-12-01), Dworsky et al.
patent: 5382930 (1995-01-01), Stokes et al.
patent: 5422533 (1995-06-01), Kosinski et al.
patent: 5446306 (1995-08-01), Stokes et al.
patent: 5587620 (1996-12-01), Ruby et al.
patent: 5596239 (1997-01-01), Dydyk
patent: 5629906 (1997-05-01), Sudol et al.
patent: 5646583 (1997-07-01), Seabury et al.
patent: 5692279 (1997-12-01), Mang et al.
patent: 5714917 (1998-02-01), Ella
patent: 5929723 (1999-07-01), Kimura et al.
patent: 609555 (1993-12-01), None
patent: 709911 (1996-05-01), None
patent: 62-76913 (1987-09-01), None
patent: IEEE publiction (1995-05-01), None
“Acoustic Bulk Wave Composite Resonators”, K. Lakin, Appl. Phys. Lett. 38(3). Feb. 1, 1981, pp. 125-127.
“Systematic Design of Stacked-Crystal Filters by Microwave Network Methods”, A. Ballato, IEEE Trans. Of Microwave Theory and Techniques, vol., MTT-22, No. 1, Jan., 1974, pp. 14-25.
“Multi-Layered Ultrasonic Transducers Employing Air-Gap Structure”, S. Yoshimoto, IEEE Trans. Of Ultra-sonic . . . vol., 42 No. 3, May 1995 pp. 339-343.
“Design of Unapodized Surface-Wave Transducers with Spectral Weighting”, G. Nudd, IEEE Trans. on Microwave Theory and Techniques, Vo., MTT-22, No. 1, Jan. 1974, pp. 14-23.
“Development of Miniature Filters for Wireless Applications”, K. Lakin et al., IEEE MTT-S Digest, 1995, pp. 883-886.
“An Air Gap Type Piezoelectric Composite Thin Film Resonator”, H. Satoh et al., IEEE, 1985, pp. 361-366.
“Coplanar Waveguides and Microwave Indicators on Silicon Substrates”, A. Reyes, IEEE, 1995, pp. 2016-2021.
“Ultrasonic in Integrated Electronics”, W. Newell, Proceedings of the IEEE, pp. 1305-1309.
“Thin Film Bulk Acoustic Wave Filters for GPS” Lakin et al., IEEE 1992 pp 471-476.
“Recent Advances in Monolithic Film Resonator Technology”, Driscoll, M.M., et al., IEEE 1986, pp. 365-369.
“A Monolithic Piezoelectric Amplitude Modulator” K.P. Bransalov, Int. J. Electronics, 1979,, vol. 47, No. 6. pp. 545-553.
“Ultralinear Small-Angle Phase Modulator” Lowe et al., Walls Symposium on Frequency Control May 29, 1991, pp. 645-648.
“Temperature Compensated High Couplijng and High . . . Substrates”, T. Shiosaki et al., Ultrasonic Symposium, 1984, pp. 405-410.
Partanen Meeri Talvikki
Ylilammi Markku Antero
Harrington & Smith ,LLP
Nguyen Tai Van
Nokia Corporation
Tugbang A. Dexter
LandOfFree
Method for fabricating a thin film bulk acoustic wave... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for fabricating a thin film bulk acoustic wave..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for fabricating a thin film bulk acoustic wave... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3379322