Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2006-12-19
2008-10-07
Kebede, Brook (Department: 2823)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C438S685000, C257SE21040
Reexamination Certificate
active
07432193
ABSTRACT:
A method for forming a thin film of a semiconductor device is provided. The method includes forming a TaN film on a semiconductor substrate by employing an atomic layer deposition method; and converting a part of the TaN film into a Ta by reacting the TaN film with NO2to form a Ta film. The NO2is formed by reacting NH3with O2.
REFERENCES:
patent: 7229918 (2007-06-01), Moon
patent: 2003/0133849 (2003-07-01), Schumacher et al.
Baek In-Cheol
Lee Han-Choon
Dongbu Electronics Co. Ltd.
Finnegan Henderson Farabow Garrett & Dunner L.L.P.
Kebede Brook
Parendo Kevin A
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