Method for fabricating a sensor

Details Method for fabricating a sensor Method for fabricating a sensor

2011-08-16

2011-08-16

Huynh, Andy (Department: 2829)

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Physical stress responsive

C438S050000, C438S051000, C257S419000, C257SE27006, C073S715000, C073S721000, C073S727000, C073S754000

Reexamination Certificate

active

07998777

ABSTRACT:
A method for fabricating a sensor is disclosed that in one embodiment bonds a first device wafer to an etched second device wafer to create a suspended structure, the flexure of which is determined by an embedded sensing element that is in electrical communication with an outer surface of the sensor through an interconnect embedded in a device layer of the first device wafer. In one embodiment the suspended structure is enclosed by a cap and the sensor is configured to measure absolute pressure.

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