Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2007-02-27
2007-02-27
Lee, Calvin (Department: 2818)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C257S759000
Reexamination Certificate
active
11066570
ABSTRACT:
A semiconductor device has a multi-layer interconnection structure with a first interlayer insulation film and a second interlayer insulation film that is formed on the first interlayer insulation film and has a hardness and an elastic modulus larger than those of the first interlayer insulation film, and is fabricated by a step of forming a resist film on the second interlayer insulation film via an antireflective film, a step of exposing to light and developing the resist film to form a resist pattern, and a step of patterning the antireflective film and the multi-layer interconnection structure using the resist pattern as a mask, wherein a film with no stress or for storing compressive stress is used as the antireflective film.
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Fujitsu Limited
Lee Calvin
Westerman, Hattori, Daniels & Adrian , LLP.
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