Method for fabricating a semiconductor device

Semiconductor device manufacturing: process – Formation of semiconductive active region on any substrate – On insulating substrate or layer

Reexamination Certificate

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C438S481000, C117S105000

Reexamination Certificate

active

06872636

ABSTRACT:
A semiconductor device fabricating method includes the step of supplying BCl3as a doping gas, SiH4as a film forming gas, and H2as a carrier gas to a reaction chamber of a semiconductor device fabricating apparatus, wherein SiH4, BCl3and H2flow in the reaction chamber on the condition that the film forming pressure ranges from about 0.1 to 100 Pa and the film forming temperature ranges from about 400 to 700° C.

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patent: 6635556 (2003-10-01), Herner et al.
patent: 20030119288 (2003-06-01), Yamazaki et al.

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