Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Making electrical device
Patent
1997-05-02
1999-01-05
Duda, Kathleen
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Making electrical device
430315, 430330, G03F 726
Patent
active
058560688
ABSTRACT:
A process for fabricating a multilayer printed circuit board, in which interlayer adhesion of the layers is greatly enhanced by curing under superatmospheric pressure. The method generally includes depositing a first resin layer (12) onto a substrate (10), which is then patterned so as to cross-link a preselected portion of the resin layer (12). A second resin layer (18) is then deposited over the first resin layer (12), and then patterned to cross-link a portion thereof. Openings in the first and second resins are developed by removing those portions of the resins that were not cross-linked during patterning. Openings (26) in the second resin layer (18) provide access to the first resin layer (12) by subsequent chemical processes. The portions of the first (12) and second (18) resin layers cross-linked during patterning remain on the substrate (10) to form permanent dielectric layers. The first resin layer (12) preferably includes a filler catalytic to plating, thereby enabling direct plating of the first resin layer (12) to form metal features within the multilayer structure. The process yields a multilayer printed circuit board that exhibits increased interlayer adhesion subsequent to plating caused by curing the first and second resin under superatmospheric pressure.
REFERENCES:
patent: 4902610 (1990-02-01), Shipley
patent: 5149615 (1992-09-01), Chakravorty
patent: 5162144 (1992-11-01), Brown et al.
patent: 5229257 (1993-07-01), Cronin
patent: 5246817 (1993-09-01), Shipley, Jr.
patent: 5260170 (1993-11-01), Brown
Magera Yaroslaw Antin
Simons Everett Furber
Duda Kathleen
Fekete Douglas D.
MacIntyre John B.
Motorola Inc.
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