Method for fabricating a packaging substrate

Details Method for fabricating a packaging substrate Method for fabricating a packaging substrate

2006-05-16

2006-05-16

Lebentritt, Michael (Department: 2812)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S686000, C438S688000

Reexamination Certificate

active

07045460

ABSTRACT:
A packaging substrate is fabricated using two plating steps for respectively plating the gold-plating areas defined on two opposite sides of the substrate. Before plating, the gold-plating areas are defined by a layer of solder mask. By doing this, the plated gold layer will not overlap with the solder mask, thereby preventing peeling or reliability problems.

REFERENCES:
patent: 5536677 (1996-07-01), Hubacher
patent: 6424036 (2002-07-01), Okada
patent: 6576540 (2003-06-01), Hsu et al.
patent: 6897090 (2005-05-01), DiStefano et al.
patent: 6930044 (2005-08-01), Weng
patent: 2003/0207499 (2003-11-01), DiStefano et al.
patent: 2005/0073035 (2005-04-01), Moxham
patent: 2005/0140026 (2005-06-01), Salmon
patent: 2005/0153483 (2005-07-01), Groenhuis et al.
patent: 2005/0179143 (2005-08-01), Moxham

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