Method for fabricating a multilayer epitaxial structure

Fishing – trapping – and vermin destroying

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437110, 148 335, H01L 21203

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053246853

ABSTRACT:
An all epitaxial process performed entirely in a CVD reactor is employed to grow heavily doped layer on lightly doped layer on a heavily doped substrate, eliminating the need for separate diffusion, even for high impurity concentrations. The process starts with a heavily doped silicon substrate of carrier concentration typically greater than 1.times.10.sup.19 per cm.sup.3. To minimize outdiffusion, the substrate is "capped" by growing very thin and heavily doped silicon layers which are depleted by hydrogen purges. A first epitaxial layer is grown over the "capped" substrate. This layer is relatively lightly doped, having a resistivity of more than 200 ohm.cm. A second epitaxial layer is then grown over the first epitaxial layer. The second epitaxial layer has a polarity opposite to that of the substrate and is heavily doped to a resistivity of less than 0.005 ohm cm.

REFERENCES:
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patent: 4696701 (1987-09-01), Sullivan
patent: 4859626 (1989-08-01), Wise
Bauer et al., Fundamental Issues in Heteroepitaxy. A Department of Energy Council on Materials Sources, Journal of Materials Research, vol. 5, #4, Apr. 1990, pp. 852-895.
Wijaranakula et al., Journal of Materials Research, vol. 1, #5, Sep./Oct. 1986, Oxygen Precipitation in Epitaxial Silicon Wafers, pp. 693-697.
Galewski et al., IEEE Transaction of Semiconductor Manufacturing, Aug. 1990, vol. 3, #3, pp. 93-97, Silicon Wafer Preparation for Low Temperature Selective Epitaxial Growth.

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