Method for fabricating a fluid ejection device

Details Method for fabricating a fluid ejection device Method for fabricating a fluid ejection device

2007-10-23

2007-10-23

Norton, Nadine (Department: 1765)

Etching a substrate: processes

Forming or treating thermal ink jet article

C216S027000, C216S058000, C216S041000, C216S042000, C216S067000, C216S088000, C438S021000, C438S626000, C438S706000, C438S712000, C438S780000, C347S065000, C347S066000, C347S050000, C347S094000, C347S100000, C347S102000

Reexamination Certificate

active

10976580

ABSTRACT:
A method of fabricating a fluid ejection device comprises providing a barrier layer which defines fluidic spaces. The fluidic spaces defined by the barrier layer are filled with filler. A throughway is etched through the substrate. The filler is removed from the fluidic spaces after etching the throughway.

REFERENCES:
patent: 6472332 (2002-10-01), Gooray et al.
patent: 6718632 (2004-04-01), Liu et al.
patent: 2003/0063163 (2003-04-01), Seaver et al.
S. Wolf, Silicon Processing for the VLSI Era, vol. 1 Lattice Press (1986) pp. 541 and 544.
S.Fuller, Jounral of Microelectromechanical Systems, vol. 11, No. 1, p. 54-60, (2002).

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