Method for fabricating a chip carrier with migration barrier, an

Details Method for fabricating a chip carrier with migration barrier, an Method for fabricating a chip carrier with migration barrier, an

1996-05-14

1998-07-07

Baxter, Janet C.

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Making electrical device

430317, 430319, 361739, 361746, 361750, G03C 500, H05K 700

Patent

active

057766622

ABSTRACT:
To inhibit the migration of conductive layers in a multilayer chip carrier, e.g., a multilayer printed circuit board, an optically cured layer 13, which is an anti-migration layer, is formed in an insulating layer 12 located between a first conductive layer 8 and a second conductive layer 6. Such a structure is formed by thinning, e.g., grinding down, a first insulating layer, leaving about half the thickness of the first insulating layer. This first insulating layer is selectively optically irradiated with actinic radiation to form an optically cured layer. Via holes are etched into the non-irradiated portions of the first insulating layer. Thereafter, a second insulating layer is formed on the first insulating layer, and it too is selectively optically irradiated with actinic radiation. Via holes are etched into the non-irradiated portions of the second insulating layer, directly over the via holes in the first insulating layer, and the second insulating layer is also thinned.

REFERENCES:
patent: 4377619 (1983-03-01), Schonhorn et al.
patent: 5460858 (1995-10-01), Yamada et al.

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