Method for exposing a semiconductor wafer by applying...

Photocopying – Projection printing and copying cameras – Focus or magnification control

Reexamination Certificate

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C355S052000, C355S053000

Reexamination Certificate

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07443484

ABSTRACT:
A method of focus variation is described herein to achieve a one-step exposure of a wafer without the limitation of applying a complex y-tilt to a wafer stage. The position of the wafer surface to be exposed is periodically varied with respect to the focal plane, or vice versa. This relative movement between the focal plane, or best focus position along the optical axis and the wafer stage, or the wafer surface, is achieved by applying a movement to at least one of the reticle stage, one or more of the optical elements of the projection lens, and the wafer stage. The frequency of the movement is selected in dependence of the laser frequency (upper limit) or the scanning frequency (lower limit).

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