Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1987-07-16
1989-07-18
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156664, B44C 122, C23F 102, C03C 1500, C03C 2506
Patent
active
048490679
ABSTRACT:
A fluorine based metal etch chemistry, wherein an admixture of etch products (or species which are closely related to etch products) is added during the post etch stage, i.e. during the stage when the pattern has partially cleared by overetch is not yet completed, to maintain the balance of chemistries which provides selectivity and anisotropy. In a tungsten etch, WF.sub.6 is usefully added during the post etch period to provide this loading.
REFERENCES:
patent: 3439238 (1969-04-01), Willims et al.
patent: 3765763 (1973-10-01), Nygaard
patent: 4250428 (1981-02-01), Oliver et al.
patent: 4293249 (1981-10-01), Whelan
patent: 4306292 (1981-12-01), Head
patent: 4393095 (1983-07-01), Greenberg
patent: 4439243 (1984-03-01), Titus
patent: 4439244 (1984-03-01), Allevato
patent: 4447469 (1984-05-01), Peters
patent: 4465898 (1984-08-01), Orcutt et al.
patent: 4493977 (1985-01-01), Arai et al.
patent: 4579609 (1986-04-01), Reif et al.
patent: 4584207 (1986-04-01), Wilson
patent: 4609103 (1986-09-01), Bimer et al.
patent: 4615905 (1986-10-01), Ovshinsky et al.
patent: 4629635 (1986-12-01), Brors
patent: 4632057 (1986-12-01), Price et al.
patent: 4673456 (1987-06-01), Spencer et al.
patent: 4684542 (1987-08-01), Jasinski et al.
patent: 4713141 (1987-12-01), Tsang
Fleming et al., "Development of Bakable Seals for Large Non-Circular Ports on the Tokamark Fusion Test Reactor", 17 Journal of Vacuum Science and Technology 337, (1980).
Accomazzo et al., "Ultra High Efficiency Membrane Filters for Semi-Conductor Process Gases", Solid State Technology 27 (3), pp. 141-146, (1984).
Kasper et al., "A Gas Filtration System for 10.sup.5 Particles/cm.sup.3 ", Aerosol Science and Technology 5 (2), pp. 167-185, (1986).
G. Lucovsky et al., "Deposition of Dielectric Films by Remove Plasma Enhanced CVD", Mat. Res. Soc. Symp. Proc. Vol. 68, 1986, pp. 323-334.
Sakai et al., "Sealing Concept of Elastic Metal Gasket `Helicaflex`," 32 Vacuum 33, (1982).
Ishimaru et al., "Bakable Aluminum Vacuum Chamber and Bellows with an Aluminum Flange and Metal Seal for Ultra High Vacuum", 26 IEEE Transactions on Nuclear Science 4000, (1979).
Carter Duane E.
Crank Sue E.
Davis Cecil J.
Jones John I.
Jucha Rhett B.
Comfort James T.
Powell William A.
Rogers Joseph E.
Sharp Melvin
Texas Instruments Incorporated
LandOfFree
Method for etching tungsten does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for etching tungsten, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for etching tungsten will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-169485