Method for etching semiconductor wafers on one side

Details Method for etching semiconductor wafers on one side Method for etching semiconductor wafers on one side

1981-06-18

1982-09-21

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156345, 156640, 156642, 156662, H01L 21306

Patent

active

043505627

ABSTRACT:
Etching a semiconductor wafer on one side by suspending the wafer on a rotating gas cushion with the wafer surface not to be etched facing the gas cushion with the other wafer surface exposed for etching. The exposed surface is sprayed with etchant and centrifuged at the same time. Subsequently, the etched surface is sprayed with rinsing agent and then centrifuged dry.

REFERENCES:
patent: 4161356 (1979-07-01), Giffin et al.
patent: 4165252 (1979-08-01), Gibbs

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