Semiconductor device manufacturing: process – With measuring or testing – Electrical characteristic sensed
Patent
1997-12-10
1999-04-20
Breneman, R. Bruce
Semiconductor device manufacturing: process
With measuring or testing
Electrical characteristic sensed
438 18, 438746, 438752, 2041293, H01L 21302
Patent
active
058952233
ABSTRACT:
A method for etching nitride is provided, by which the etching rate and the roughness of the etching surface can be powerfully controlled, and by which the etching depth can be in-situ monitored. The etching method comprises the steps of: (i) coating a first electrode on a nitride chip; (ii) mounting the nitride chip on a holding device; (iii)dipping the holding device, the nitride chip and the first electrode in electrolysis liquid; (iv) irradiating the nitride chip with a UV light having a wavelength shorter than 254 nm; and (v) connecting the first electrode to a second electrode dipped in the electrolysis liquid by a galvanometer to in-situ monitor the etching current, so as to in-situ control the etching depth.
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Chen Chin-Yuan
Chuang Chih-Wei
Ho Jin-Kuo
Peng Lung-Han
Breneman R. Bruce
Goudreau George
Industrial Technology Research Institute
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