Method for etching an electrically conductive layer applied to a

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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Details

156639, 156656, 1566591, 156665, 156666, 156902, 156662, 156345, B44C 122, C23F 100, C03C 1500, H01L 21306

Patent

active

049699733

ABSTRACT:
In the etching by means of an etching solution of an electrically conductive layer applied to a substrate the time profile or variation of the diffusion current flowing between the layer to be etched away and the etching solution is measured. The substrate is removed from the etching solution as soon as the diffusion current passes through a steep drop for the second time and assumes a constant value.

REFERENCES:
patent: 4462856 (1984-07-01), Abe et al.
patent: 4662975 (1987-05-01), Dufresne et al.

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