Method for etching a pattern

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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Details

156646, 156653, 156656, 156657, 1566591, 357 65, 437200, 437203, B44C 122, C03C 1500, C03C 2506, C23F 102

Patent

active

049542184

ABSTRACT:
A photoresist layer having a prescribed pattern is formed on a substrate to be etched. The substrate is immersed into a predetermined solution to form a layer on the substrate except on those portions where the photoresist layer is formed. The photoresist layer is removed, and the substrate is etched using the remaining layer as a mask.

REFERENCES:
patent: 4261792 (1981-04-01), Tsuji et al.
patent: 4496419 (1985-01-01), Nulman et al.

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