Method for etched and/or galvanic production of ring zones in sm

Details Method for etched and/or galvanic production of ring zones in sm Method for etched and/or galvanic production of ring zones in sm

1981-09-02

1982-11-02

Kimlin, Edward C.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

1566591, 156664, 430312, 430314, 430316, 430318, 204 15, B44C 122, C23F 100, H01L 21312

Patent

active

043572057

ABSTRACT:
A method employing etching technique alone or in combination with galvanic production of electrically conducting or insulating ring zones in small diameter holes which extend through a workpiece having a small thickness employs the steps of applying a base metallization to the surface of the workpiece including the walls of the holes, filling the holes with a positive photoresist which upon drying withdraws from the hole openings toward the inside of the hole forming a plug therein, irradiating both sides of the workpiece with ultraviolet light for making the photoresist partially soluble for a lacquer developer, and dissolving the partially soluble photoresist away up to a selected lacquer ring thickness. These steps are then followed by one of two steps. For the production of insulating ring zones one or several metal films are applied by galvanic deposition to those regions which have been freed of photoresist and the residual photoresist is dissolved away and the base metallization is selectively etched. For the production of conducting ring zones the base metallization is removed by etching technique from those regions of the holes which have been freed of photoresist.

REFERENCES:
patent: 3284322 (1966-11-01), Pearlstein
patent: 3349480 (1967-10-01), Rushleigh
patent: 3577239 (1968-12-01), Lesnieski
patent: 3956667 (1976-05-01), Veith
patent: 4047077 (1977-09-01), Veith

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