Abrading – Precision device or process - or with condition responsive... – Computer controlled
Reexamination Certificate
2006-12-19
2006-12-19
Ackun, Jr., Jacob K. (Department: 3723)
Abrading
Precision device or process - or with condition responsive...
Computer controlled
C700S164000
Reexamination Certificate
active
07150673
ABSTRACT:
A polishing method can automatically reset polishing conditions according to a state of a polishing member based on data on a polishing profile changing with time, thereby extending life of the polishing member and obtaining flatness of a polished surface with higher accuracy. The polishing method, includes steps of: independently applying a desired pressure by each of pressing portions of a top ring on a polishing object; estimating a polishing profile of the polishing object based on set pressure values, and calculating a recommended polishing pressure value so that a difference between the polishing profile of the polishing object after it is polished under certain polishing conditions and a desired polishing profile becomes smaller; and polishing the polishing object with the recommended polishing pressure value.
REFERENCES:
patent: 5605488 (1997-02-01), Ohashi et al.
patent: 5695601 (1997-12-01), Kodera et al.
patent: 5762539 (1998-06-01), Nakashiba et al.
patent: 5908530 (1999-06-01), Hoshizaki et al.
patent: 5943230 (1999-08-01), Rinnen et al.
patent: 6230069 (2001-05-01), Campbell et al.
patent: 6468131 (2002-10-01), Korovin
patent: 6476921 (2002-11-01), Saka et al.
patent: 6486492 (2002-11-01), Su
patent: 6594542 (2003-07-01), Williams
patent: 6776692 (2004-08-01), Zuniga et al.
patent: 2003/0023402 (2003-01-01), Kobayashi et al.
Masahiro Kimura et al., “A New Method for the Precise Measurement of Wafer Roll off of Silicon Polished Wafer”, J. Appl. Phys., vol. 38, pp. 38-39, Part 1, No. 1A, Jan. 1999 © 1999 Publication Board, Japanese Journal, of Applied Physics.
Fukuda Akira
Hirokawa Kazuto
Hiyama Hirokuni
Mochizuki Yoshihiro
Sakurai Kunihiko
Ackun Jr. Jacob K.
Ebara Corporation
Wenderoth , Lind & Ponack, L.L.P.
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