Metal fusion bonding – Solder form
Patent
1998-04-30
2000-12-12
Heinrich, Samuel M.
Metal fusion bonding
Solder form
428403, 428643, B23K 3524, B23K 3526
Patent
active
061586447
ABSTRACT:
This invention relates to a solder structure which provides enhanced fatigue life properties when used to bond substrates particularly at the second level such as BGA and CGA interconnections. The solder structure is preferably a sphere or column and has a metal layer wettable by solder and the structure is used to make solder connections in electronic components such as joining an electronic module such as a chip connected to a MLC which module is connected to a circuit board. The solder structure preferably has an overcoat of solder on the metal layer to provide a passivation coating to the metal layer to keep it clean from oxidation and corrosion and also provide a wettable surface for attachment of the solder structure to solder on the pads of the substrate being bonded.
REFERENCES:
patent: 4722471 (1988-02-01), Gray et al.
patent: 4788767 (1988-12-01), Desai et al.
patent: 5147084 (1992-09-01), Behun et al.
patent: 5159535 (1992-10-01), Desai et al.
patent: 5170931 (1992-12-01), Desai et al.
patent: 5201451 (1993-04-01), Desai et al.
patent: 5251806 (1993-10-01), Agarwala et al.
patent: 5324569 (1994-06-01), Nagesh et al.
Brofman Peter J.
Courtney Mark G.
Farooq Shaji
Interrante Mario J.
Jackson Raymond A.
Blecker Ira D.
Heinrich Samuel M.
International Business Machines - Corporation
Tomaszewski John J.
LandOfFree
Method for enhancing fatigue life of ball grid arrays does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for enhancing fatigue life of ball grid arrays, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for enhancing fatigue life of ball grid arrays will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-208317