Method for encapsulation of a chip card and module obtained...

Details Method for encapsulation of a chip card and module obtained... Method for encapsulation of a chip card and module obtained...

2008-01-22

2008-01-22

Parker, Kenneth (Department: 2815)

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

C257SE23064, C257S678000, C257S681000, C235S492000, C235S488000, C174S050510, C174S521000, C156S252000, C156S253000, C156S295000

Reexamination Certificate

active

10511792

ABSTRACT:
Method for conditioning of an electronic microcircuit designed for the production of an electronic module which can be glued by means of a simple glue or by soldering. For this purpose the microchip has a geometric shape compatible with a recess in a card provided to accommodate it and has a means serving as a mask compatible with the card. Ultimately this mask also serves to prevent an outflow of a resin coating used to protect a chip included in this type of module. The mask is glued to a support having, on a first face, the contact area, and on a second face the mask and the chip. The mask includes a window determining the placement of the chip.

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