Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
Inventor
active
Electrical connecting device having mating state indication...
Method for encapsulation of a chip card and module obtained...
Method for encapsulation of a chip card and module obtained...
No associations
LandOfFree
Jean-Pierre Radenne does not yet have a rating. At this time, there are no reviews or comments for this inventor.
If you have personal experience with Jean-Pierre Radenne, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Jean-Pierre Radenne will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-P-2388999