Method for encapsulating multiple integrated circuits

Details Method for encapsulating multiple integrated circuits Method for encapsulating multiple integrated circuits

2007-11-13

2007-11-13

Williams, Alexander Oscar (Department: 2826)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S508000, C438S112000, C438S127000, C438S126000, C438S015000, C257S790000, C257S788000, C257SE23092, C029S841000, C029S832000, C029S831000

Reexamination Certificate

active

11213064

ABSTRACT:
A device, such as an integrated circuit or an electronic circuit component is affixed to a substrate. A first encapsulation structure encases a first integrated circuit and has at least one groove formed therein. An adhesive partially fills the groove in the first encapsulation structure. A second integrated circuit is affixed to the first encapsulation structure by use of the adhesive in the groove. A second encapsulation structure at least partially encases the first encapsulation structure, the first integrated circuit, and the second integrated circuit.

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